E&R Engineering to Launch New Malaysia Plant: Expanding Global Packaging Materials Production and Localized Services

KAOHSIUNG, Oct. 5, 2026 /PRNewswire/ — E&R Engineering Corp., (TWSE: 8027) an international provider of semiconductor packaging equipment, announced today the upcoming grand opening of its new Malaysian subsidiary—E&R SEMICONDUCTOR (MALAYSIA) SDN. BHD.—at the Melaka Free Trade Zone on October 13. E&R Engineering Opens New Malaysia Plant to Strengthen Semiconductor Packaging Support To meet surging […]